As the market demand for electronic equipment continues to flourish, prompting more intense competition, companies only continue to introduce new products and creative highlights, continue to attract the attention of consumers, in order to greater stabilization of the market.
But the continuous reduction in the volume of electronic products, electronic technology has put forward higher requirements, packaging miniaturization, assembly precision, functional integration are the new direction of the current electronic technology, when the product patch is completed, if you need to test it, there may be a greater difficulty in the market for the emergence of a variety of nondestructive testing equipment, such as X-RAY testing, ultrasonic testing, magnetic particle testing, etc., but the real However, most of them still rely on X-RAY inspection with reference value.
With the increasing application of BGA, CSP, LGA and other bottom terminal package components, visualization and SPI, AOI is no longer able to effectively detect the quality of its welding.
Today's new inspection techniques such as slice analysis, dye analysis, etc. require destructive treatment of PCBA, which will undoubtedly increase manufacturing costs.
X-Ray inspection equipment adopts X-ray transmission principle to non-destructive testing of invisible solder joints at the bottom of the package, which does not require additional costs, is fast and accurate, and has a good guiding role in technical analysis, and is widely used in electronic assembly and failure analysis.
The X-ray inspection equipment produced by Rui Ao Inspection is very suitable for IC component solder joint inspection, its X-ray inspection has high-definition X-ray images, and at the same time has the function of analyzing defects (e.g., open circuit, short circuit, leakage solder, etc.).
Not only that, but Riello's X-ray inspection equipment also has enough magnification to allow producers to easily see detailed product defects, thus meeting the needs of the present and the future.